hsmx-a46x-xxxxx smt led surface mount led indicator data sheet description the power plcc-4 smt led with lens are high perfor - mance plcc-4 package size smt leds targeted mainly in automotive & electronics signs and signals (ess) markets. these top-mount single-chip packages with focused radiation ofer high brightness in beam direc - tion and are excellent for interior automotive, indoor and outdoor sign and industrial applications. with ad - ditional lens in 50 variants, these products are espe - cially ftting to applications for mono-color text display, chmsl and displays. the plcc-4 package family is able to dissipate heat bet - ter compared to the plcc-2 packages. in proportion to this increase in driving current, this family of leds is able to produce higher light output compared to the conventional plcc-2 smt leds. as an extension of the standard fat top plcc-4 smt leds, the power plcc-4 with lens device is able to pro - vide focused beams within narrow viewing angles (50) meeting the markets requirements for focused radia - tion and high brightness in beam directions. the power plcc-4 smt led with 50 is ideal for panel, push button, general backlighting, automotive interior & exterior (cluster backlighting, side repeaters, brake lights), sign and symbol illumination, ofce equipment, industrial equipment and home appliances applica - tions. this package design coupled with careful selec - tion of component materials allow the power plcc-4 smt led with lens to perform with higher reliability in a larger temperature range -40c to 100c. this high reliability feature is crucial to allow the power plcc-4 smt led with lens to do well in harsh environments such as its target automotive & ess markets. the power plcc4 smt led with lens package is also designed to be compatible with both ir-solder re-fow and through- the-wave soldering. features ? industry standard plcc-4 ? high reliability led package ? high brightness using alingap dice technologies ? high optical efciency ? narrow viewing angle at 50 ? available in 8mm carrier tape on 7-inch reel applications ? interior automotive C instrument panel backlighting C central console backlighting C cabin backlighting C navigation and audio system C dome lighting C push button backlighting ? exterior automotive C turn signals C chmsl C rear combination lamp C side repeaters ? ofce automation, home appliances, industrial equipment C front panel backlighting C push button backlighting C display backlighting
2 package drawing pin hsmx-a46x leadfconfguration 1 cathode 2 anode 3 cathode 4 cathode tablef1.fdevicefselectionfguide color partfnumber luminousfintensity,f f v f [1] ff(mcd) testfcurrentf(ma) diceftechnology min.fivf(mcd) typ.fivf(mcd) max.fivf(mcd) amber hsma-a460-w50m1 1125 2100 3550 50 alingap amber hsma-a461-x83m1 2240 3300 5600 50 alingap red HSMC-A460-U30M1 450 580 900 50 alingap red hsmc-a461-v00m1 715 1750 - 50 alingap orange hsml-a461-w40m1 1125 1850 2850 50 alingap notes: 1. the luminous intensity iv, is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. tolerance = 12% note: 1. all dimensions in millimeters. 2. terminal finish: ag plating 3. electrical connection between all cathode is recommended figuref1.fpackagefdrawing
3 tablef2.fabsolutefmaximumfratingsf(t a f=f25fc) parameters hsma/c/l dc forward current [1] 70 ma peak forward current [2] 200 ma power dissipation 180 mw reverse voltage 5 v junction temperature 110c operating temperature -40 c to +100 c storage temperature -40 c to +100 c notes: 1. derate linearly as shown in figure 6. 2. duty factor = 10%, frequency = 1khz tablef3.fopticalfcharacteristicsf(t a f=f25fc) color part number dice technology peak wavelengthf l peak (nm) dominantf wavelengthf l df [1] (nm) viewing angle 2 q ?f [2] (degrees) luminous efcacy f h vf [3] f(lm/w) luminousf efciency h e f(lm/w) luminous f intensity/ftotalf fluxf [4,f5] f i v f(cd)f/f f v f(lm) typ. typ. typ. typ. typ. typ. amber hsma-a46x alingap 592 590 50 480 22 1.35 red hsmc-a46x alingap 635 626 50 150 19 1.15 orange hsml-a46x alingap 609 605 50 320 23 1.05 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 2. q ? is the of-axis angle where the luminous intensity is ? the peak intensity. 3. radiant intensity, ie in watts / steradian, may be calculated from the equation i e = i v / h v , where iv is the luminous intensity in candelas and h v is the luminous efcacy in lumens / watt. 4. f v is the total luminous fux output as measured with an integrating sphere after the device has stabilized. 5. flux tested at mono pulse conditions. tablef4.felectricalfcharacteristicsf(t a f=f25fc) partfnumber forwardfvoltagefv f f(volts)f@fi f f=f50fma reversefvoltage v r f@f100 m a thermal resistance r q j-p f(c/w) typ. max. min. hsma-a46x 2.20 2.50 5 110 hsmc-a46x 2.20 2.50 5 110 hsml-a46x 2.20 2.50 5 110 part numbering system h s m x 1 ? a x 2 x 3 x 4 ? x 5 x 6 x 7 x 8 x 9 color bin selection intensity bin selection device specific configuration package type led chip color packaging option
4 figuref2.ffrelativefintensityfvs.fwavelength figuref3.ffforwardfcurrentfvs.fforwardfvoltage. figuref4.ffrelativefintensityfvs.fforwardfcurrent figuref5.frelativefintensityfvs.ftemperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity alingap re d alingap orange alingap ambe r 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 forward voltage - v forward current - ma hsma/c/l 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 dc forward current - ma relative luminous intensity (normalized at 50 ma) hsma hsmc/l 0 0.5 1 1.5 2 2.5 -50 -25 0 2 5 5 0 7 5 100 125 ambient temperature - c normalized luminous intensity alingap red alingap orange alingap amber
5 figuref6a.ffmaximumfforwardfcurrentfvs.fambientftemperature. f deratedffbasedfonft j maxf=f110c,fr q j-a =f300c/w,f350c/wfandf470c/w. figuref6b.ffmaximumfforwardfcurrentfvs.fsolderfpointftemperature. f deratedffbasedfonft j maxf=f110c,fr q j-p f=f110c/w. figuref7.ffdominantfwavelengthfvs.fforwardfcurrent. figuref8.ffforwardfvoltagefshiftfvs.ftemperature. figuref9.ffradiationfpattern 0 20 40 60 80 0 2 0 4 0 6 0 8 0 100 120 ambient temperature - c r ja = 350c/w r ja = 470c/w r ja = 300c/w maximum forward current - m a 585 590 595 600 605 610 615 620 625 630 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 forward current - ma dominant wavelength - nm alingap red alingap orange alingap amber 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity -0.15 -0.1 -0.05 0 0.05 0.1 0.15 -50 -25 0 2 5 5 0 7 5 100 junction temperature - c forward voltage shift - v 0 20 40 60 80 0 2 0 4 0 6 0 8 0 100 120 solder point temperature (c) maximum forward current - ma
6 figuref11a.ffrecommendedfsolderingfpadfpatter figuref11b.ffrecommendedfsolderingfpadfpatterf(ttw) figuref10.ffrecommendedfpb-freefrefowfsolderingfprofle. temperature tim e 10 to 20 sec . 255 ?c +5?c -0?c 125?c +/- 25?c 217?c 3?c/sec max. max. 120 sec. -6?c/sec m ax. 60-150 sec. note:fforfdetailfinformationfonfrefowfsolderingfoffavagofsurfacefmountfleds,fdofreferftofavagofapplicationfnotefanf1060fsurfacefmountingfsmtfledfindi - catorfcomponents. thermal resistance solderfpad areaf(xy) 300c/w >16mm 2 350c/w >12mm 2 470c/w >8mm 2 2.60 (0.103) solder resist represents electrical connectivity between pads 4.50 (0.178) y x 0.40 (0.016) x 0.50 (0.020) y 1.10 (0.043) 1.50 (0.059) dimensions in mm (inches). x x 0.5 (0.020) y y 1.0 (0.039) 2.0 (0.079) 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) 2.8 (0.110) 6.1 (0.240) dimensions in mm (inches). represents electrical connectivity between pads solder resist
7 figuref12.ffsoftftipfvacuumfpick-upftoolfforfextractingfsmtfledfcomponentsffromfcarrierftape. figuref13.ftapefleaderfandftrailerfdimensions. figuref14.fftapefdimensions. 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 960 mm min. for ? 330 reel. c a user feed direction
8 moisture sensitivity this product is qualifed as moisture sensitive level xx per jedec j-std-020. precautions when handling this mois - ture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to refow the leds per the original msl rating. - it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read immediately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. c. control for unfnished reel - for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their foor life of 672 hours. e. baking is required if: - 10% or 15% hic indicator turns pink. - the leds are exposed to condition of >30c / 60% rh at any time. - the leds foor life exceeded 672 hours. recommended baking condition: 605c for 20 hours. figuref15.ffreelingforientation. cathode side user feed direction printed label
intensity bin select (x 5 x 6 ) individual reel will contain parts from one half bin only x 5 f minfivfbin x6 0 full distribution 2 2 half bins starting from x51 3 3 half bins starting from x51 4 4 half bins starting from x51 5 5 half bins starting from x51 6 2 half bins starting from x52 7 3 half bins starting from x52 8 4 half bins starting from x52 9 5 half bins starting from x52 intensityfbinflimits binfid min.f(mcd) max.f(mcd) u1 450.00 560.00 u2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 y1 2850.00 3550.00 y2 3550.00 4500.00 z1 4500.00 5600.00 z2 5600.00 7150.00 11 7150.00 9000.00 12 9000.00 11250.00 21 11250.00 14000.00 22 14000.00 18000.00 tolerance of each bin limit = 12% color bin select (x 7 ) individual reel will contain parts from one full bin only. x 7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only q a, b and c only p b, c and d only n c, d and e only m d, e and f only 1 a, b, c and d only 3 b, c, d and e only 4 c, d, e and f only 5 a, b, c, d and e only 6 b, c, d, e, and f only colorfbinflimits amber min.f(nm) max.f(nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange min.f(nm) max.f(nm) a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 redf min.f(nm) max.f(nm) full distribution 620.0 635.0 tolerance of each bin limit = 1nm
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2007 avago technologies limited. all rights reserved. av02-0529en - june 26, 2007 packaging option (x 8 x 9 ) option testfcurrent packageftype reelfsize m1 50ma top mount 7 vffbinflimits binfid min. max. va 1.9 2.2 vb 2.2 2.5 vc 2.5 2.8 vd 2.8 3.1 ve 3.1 3.4 tolerance of each bin limit = 0.1v
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